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 APM4548K
Dual Enhancement Mode MOSFET (N-and P-Channel)
Features
*
N-Channel 30V/7A, RDS(ON) = 18m (typ.) @ VGS = 10V RDS(ON) = 23m (typ.) @ VGS = 4.5V
Pin Description
*
P-Channel -30V/-6A, RDS(ON) = 32m (typ.) @ VGS =-10V RDS(ON) = 42m (typ.) @ VGS =-4.5V Top View of SOP - 8
(8) D1 (7) D1
* * *
(3) S2
Super High Dense Cell Design Reliable and Rugged Lead Free Available (RoHS Compliant)
(2) G1
(4) G2
Applications
*
Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems
S1 (1)
D2 (5)
D2 (6)
N-Channel MOSFET P-Channel MOSFET
Ordering and Marking Information
APM4548 Lead Free Code Handling Code Temp. Range Package Code Package Code K : SOP-8 Operating Junction Temp. Range C : -55 to 150 C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code
APM4548 K :
APM4548 XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005 1 www.anpec.com.tw
APM4548K
Absolute Maximum Ratings
Symbol VDSS VGSS ID* IDM* I S* TJ TSTG PD* RJA*
Note: *Surface Mounted on 1in pad area, t 10sec.
2
(TA = 25C unless otherwise noted)
N Channel 30 20 VGS=10V (N) VGS=-10V (P) 7 30 1.2 150 -55 to 150 TA=25C TA=100C 2 0.8 62.5 W C/W P Channel -30 20 -6 -20 -1 A C V A Unit
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Diode Continuous Forward Current Maximum Junction Temperature Storage Temperature Range Power Dissipation
Thermal Resistance-Junction to Ambient
Electrical Characteristics
(TA = 25C unless otherwise noted)
Symbol
Parameter
Test Condition
APM4548K Min. Typ. Max.
Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250A VGS=0V, IDS=-250A VDS=24V, VGS=0V IDSS Zero Gate Voltage Drain Current TJ=85C VDS=-24V, VGS=0V TJ=85C VGS(th) Gate Threshold Voltage IGSS Gate Leakage Current VDS=VGS, IDS=250A VDS=VGS, IDS=-250A VGS=20V, VDS=0V VGS=10V, IDS=7A RDS(ON) a Drain-Source On-State Resistance VGS=-10V, IDS=-6A VGS=4.5V, IDS=5A VGS=-4.5V, IDS=-5A N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 18 32 23 42 1 -1 1.5 -1.5 30 -30 1 30 -1 -30 2 -2 100 100 24 42 30 55 m nA V A V
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Electrical Characteristics (Cont.)
(T A = 25C unless otherwise noted)
Symbol
Parameter
Test Condition
APM4548K Min. Typ. Max.
Unit
Diode Characteristics VSD a Diode Forward Voltage ISD =2A, V GS=0V ISD =-2.3A, V GS=0V N-Ch P-Ch 0.8 -0.8 1.3 -1.3 V
Dynamic Characteristics b RG C iss C oss C rss td(ON) Tr td(OFF) Tf Gate Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time V GS=0V,V DS=0V,F=1MHz N-Channel V GS=0V, V DS=15V, Frequency=1.0MHz P-Channel V GS=0V, V DS=-15V, Frequency=1.0MHz N-Channel V DD=15V, R L=15, IDS =1A, V GEN =10V, R G =6 P-Channel V DD=-15V, R L=15, IDS =-1A, V GEN =-10V, R G =6 N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 2.5 11 960 980 180 155 100 120 7 7 9 10 34 38 12 14 5 nC 3 14 14 17 20 62 70 23 26 ns pF
Turn-off Fall Time
Q rr
N-Channel ISD =7A, dISD /dt =100A/s Reverse Recovery Charge P-Channel ISD =-6A, dISD /dt =100A/s
Gate Charge Characteristics b Qg Q gs Q gd
Notes: a : Pulse test ; pulse width300s, duty cycle2%. b : Guaranteed by design, not subject to production testing.
Total Gate Charge Gate-Source Charge Gate-Drain Charge
N-Channel V DS=15V, VGS=10V, IDS =7A P-Channel V DS=-15V, VGS=-10V, IDS =-6A
N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch
19 24 2 2 3.6 3.7
25 30 nC
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Typical Characteristics
N-Channel Power Dissipation
2.5
Drain Current
8 7
2.0
ID - Drain Current (A)
6 5 4 3 2
Ptot - Power (W)
1.5
1.0
0.5
1
0.0 TA=25 C 0 20 40 60 80 100 120 140 160
o
0
TA=25 C,VG=10V 0 20 40 60 80 100 120 140 160
o
Tj - Junction Temperature (C)
Tj - Junction Temperature (C)
Safe Operation Area Normalized Transient Thermal Resistance
100
2 1
Thermal Transient Impedance
Duty = 0.5 0.2
ID - Drain Current (A)
10
Rd s(o n) Lim it
1ms
0.1
0.1 0.05 0.02 0.01
10ms
1
100ms 1s
0.01
Single Pulse Mounted on 1in pad o RJA : 62.5 C/W
2
0.1
DC
T =25 C 0.01 A 0.01 0.1
O
1
10
100
1E-3 1E-4
1E-3
0.01
0.1
1
10 30
VDS - Drain - Source Voltage (V)
Square Wave Pulse Duration (sec)
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Typical Characteristics (Cont.)
N-Channel Output Characteristics
30 VGS= 4, 5, 6, 7, 8, 9, 10V
Drain-Source On Resistance
40 35 30 25 20 15 10 5 VGS=4.5V
20
15
3V
RDS(ON) - On - Resistance (m)
25
ID - Drain Current (A)
VGS=10V
10
5 2V 0.5 1.0 1.5 2.0 2.5 3.0
0 0.0
0
5
10
15
20
25
30
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
30 1.6
Gate Threshold Voltage
IDS =250A
Normalized Threshold Voltage
5
25
1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50 -25
ID - Drain Current (A)
20
15
Tj=125 C 10 Tj=25 C
o o
o
Tj=-55 C 5
0
0
1
2
3
4
0
25
50
75
100 125 150
VGS - Gate - Source Voltage (V)
Tj - Junction Temperature (C)
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Typical Characteristics (Cont.)
N-Channel Drain-Source On Resistance
1.8 VGS = 10V 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -50 -25 RON@Tj=25 C: 18m 0 25 50 75 100 125 150
o
Source-Drain Diode Forward
30
IDS = 7A
10 Tj=150 C
o
Normalized On Resistance
IS - Source Current (A)
1
Tj=25 C
o
0.1 0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Tj - Junction Temperature (C)
VSD - Source - Drain Voltage (V)
Capacitance
1500
10
Gate Charge
VDS= 15V ID= 7A
Frequency=1MHz
VGS - Gate - source Voltage (V)
1200
8
C - Capacitance (pF)
Ciss 900
6
600
4
300
2
Crss
Coss
0
0
0
5
10
15
20
25
0
4
8
12
16
20
VDS - Drain - Source Voltage (V)
QG - Gate Charge (nC)
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
6
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APM4548K
Typical Characteristics (Cont.)
P-Channel Power Dissipation
2.5
7 6
Drain Current
2.0
1.5
-ID - Drain Current (A)
5 4 3 2 1
Ptot - Power (W)
1.0
0.5
o
0.0
TA=25 C 0 20 40 60 80 100 120 140 160
0
TA=25 C,VG=-10V 0 20 40 60 80 100 120 140 160
o
Tj - Junction Temperature (C)
Tj - Junction Temperature (C)
Safe Operation Area Normalized Transient Thermal Resistance
100
Thermal Transient Impedance
2 1
Duty = 0.5 0.2 0.1
-ID - Drain Current (A)
Rd s(o n) Lim it
10
300us 1ms
0.1
0.05 0.02 0.01
1
10ms 100ms
0.01
Single Pulse
0.1
1s DC
T =25 C 0.01 A 0.01 0.1
O
1
10
100
1E-3 1E-4
Mounted on 1in pad o RJA : 62.5 C/W
2
1E-3
0.01
0.1
1
10 30
-VDS - Drain - Source Voltage (V)
Square Wave Pulse Duration (sec)
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
7
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APM4548K
Typical Characteristics (Cont.)
P-Channel Output Characteristics
20 18 16 VGS= -4,-5,-6,-7,-8,-9,-10V 80 70
Drain-Source On Resistance
RDS(ON) - On - Resistance (m)
60 50 40 VGS= -10V 30 20 10 0 VGS= -4.5V
-ID - Drain Current (A)
14 12 10 8 -3V 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
0
4
8
12
16
20
-VDS - Drain - Source Voltage (V)
-ID - Drain Current (A)
Transfer Characteristics
20 18 16
Gate Threshold Voltage
1.6 IDS = -250A 1.4
Normalized Threshold Voltage
5
1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25
-ID - Drain Current (A)
14 12 10 8 6 4 2 0 0 1 2 3 4 Tj=25 C
o
Tj=125 C Tj=-55 C
o
o
0
25
50
75 100 125 150
-VGS - Gate - Source Voltage (V)
Tj - Junction Temperature (C)
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Typical Characteristics (Cont.)
P-Channel Drain-Source On Resistance
1.8 VGS = -10V 1.6 IDS = -6A
Source-Drain Diode Forward
20 10 Tj=150 C
o
Normalized On Resistance
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 RON@Tj=25 C: 32m 0 25 50 75 100 125 150
o
-IS - Source Current (A)
1
Tj=25 C
o
0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Tj - Junction Temperature (C)
-VSD - Source - Drain Voltage (V)
Capacitance
1400 Frequency=1MHz 1200 1000 800 600 400 200 Crss 0
0 10 VDS= -15V ID= -6A 8
Gate Charge
C - Capacitance (pF)
Ciss
-VGS - Gate - source Voltage (V)
6
4
2
Coss
0
4
8
12
16
20
0
5
10
15
20
25
-VDS - Drain - Source Voltage (V)
QG - Gate Charge (nC)
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
9
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APM4548K
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
0.004max.
Dim A A1 D E H L e1 e2 1
Millimeters Min. 1.35 0.10 4.80 3.80 5.80 0.40 0.33 1.27BSC 8 Max. 1.75 0.25 5.00 4.00 6.20 1.27 0.51 Min. 0.053 0.004 0.189 0.150 0.228 0.016 0.013
0.015X45
Inches Max. 0.069 0.010 0.197 0.157 0.244 0.050 0.020 0.50BSC 8
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp Critical Zone T L to T P
Ramp-up
Temperature
TL Tsmax
tL
Tsmin Ramp-down ts Preheat
25
t 25 C to Peak
Time
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (T L) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds
6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface.
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Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
APM4548K
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process - Package Peak Reflow Temperature s 3 3 Package Thickness Volume mm Volume mm <350 350 <2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C
Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level.
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles
Carrier Tape & Reel Dimensions
t E Po P P1 D
F W
Bo
Ao
D1
Ko
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
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APM4548K
Carrier Tape & Reel Dimensions(Cont.)
T2
J C A B
T1
Application
A 3301 F 5.5 0.1
B 62 1.5
C 12.75 + 0.1 5
J 2 + 0.5
T1 12.4 +0.2 P1 2.0 0.1
T2 2 0.2 Ao 6.4 0.1
W 12 + 0.3 - 0.1 Bo 5.2 0.1
P 8 0.1
E 1.75 0.1
SOP-8
D D1 Po 1.550.1 1.55+ 0.25 4.0 0.1
Ko t 2.1 0.1 0.30.013
Cover Tape Dimensions
Application SOP- 8 Carrier Width 12 Cover Tape Width 9.3
(mm)
Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright (c) ANPEC Electronics Corp. Rev. B.1 - Sep., 2005
13
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